In: Electrical Engineering
1. write a program for the msp430fr6989 that will light LED1, whenever S1 is pressed. It should turn off whenever S1 is released. 2. Write a program that will make LED1 blink 5 times when S1 is pressed, and then stop.
In: Electrical Engineering
given the sequences
x1 = cos (0.5*pi*n) + cos (0.25*pi*n) + cos (0.125*pi*n); for n = 0
to 7;
x2 = sin (0.5*pi*n) - cos (o.25*pi*n) + sin (0.125*pi*n); for n = 0
to 7;
plot the sequences and comment on the results. increasing the
number of samples to n = 0 to 99, compute the DFT of the two
sequences in MATLAB and plot the magnitude and phase of the
computed DFTs. comment on the results
In: Electrical Engineering
Draw block diagram of the JPEG default encoder for encoding still colour image.
Describe progressive and hierachical mode of JPEG compression standard, respectively
Describe how image artifacts occur in decoded still images
In: Electrical Engineering
Q1. Explain how industrial Ethernet can be incorporated in DCS systems.
Q2. Explain in detail the self-diagnosis concepts of a DCS system.
In: Electrical Engineering
A designer must anticipate and understand the manufacturing processes that will be used to fabricate the created components. Describe differences in the model for a part designed for polyethylene (plastic) injection molding versus one for machined aluminum. Can you anticipate unique model requirements for a part created using hand lay-up resin-transfer molded composite (a process similar to that used for fiberglass)?
In: Electrical Engineering
How would you explain the view of a control chart and what is the basic procedure for creating it?
In: Electrical Engineering
Voltage Scaling on Oscilloscope
Time scaling
Picture is required here from oscilloscope
Triggering Function
Picture is required here from oscilloscope
Cursor function
Picture is required here from oscilloscope
In: Electrical Engineering
Time Scaling on Oscilloscope
and function generator to triangular wave
In: Electrical Engineering
Explain with suitable diagram how n-type semiconductor can be obtained from intrinsic silicon
In: Electrical Engineering
Discuss the advantages and disadvantages of IC assembly-based wirebond interconnections versus flip chip interconnections.
In: Electrical Engineering
Define/explain intrinsic semiconductor. What are its characteristics
In: Electrical Engineering
The inner and outer diameter of a single core cable
are 3 cm and 8.5 cm The insulated with two materials having
relative permittivity of 5 and 3.5 respectively with corresponding
maximum electric stresses of 35 kV/cm and 25 kV/cm. Draw the
configuration and calculate:
a) the radial thickness of each insulating layer.
b) the safe working voltage of the cable.
c) draw the voltage and electric stress as a function of radial
distance from center to metal sheath.
In: Electrical Engineering
arduino firmware coding for bidirectional closed loop buck boost converter pwm signal
In: Electrical Engineering