Which 3 of the following process techniques will enhance the number of die from each wafer...

Which 3 of the following process techniques will enhance the number of die from each wafer ?

		Improve filtration of gas and chemicals.
		Work with vendors to increase the service interval for tools.
		Use a larger-diameter wafer.
		Automate transport within the fab using FOUPs.
		Use thinner saw blades for singulation.
		Optimize gate layout to give smaller die.

Expert Solution

Which 3 of the following process techniques will enhance the number of die from each wafer ?

		Improve filtration of gas and chemicals.--------ANSWER
		Work with vendors to increase the service interval for tools.
		Use a larger-diameter wafer.
		Automate transport within the fab using FOUPs.-----ANSWER
		Use thinner saw blades for singulation.
		Optimize gate layout to give smaller die.-----ANSWER a FOUP administration framework, for dealing with a majority of different parcel FOUPs; a constant dispatch framework for controlling dispatching of wafer part arranges inside a wafer creation framework; a programmed material taking care of incorporation framework having a stocker for putting away and sequencing a majority of FOUPs, the stocker having an installed sorter arranged there inside for sorting wafers inside a majority of numerous parcel FOUPs, and a FOUP transportation framework for transporting FOUPs inside a wafer manufacture office; a make execution framework in agent correspondence with the continuous dispatch framework for controlling formula handling and for controlling stream of FOUPs inside the FAB; and a PC coordinated assembling framework for computerizing gear inside the AMHS. Furthermore gave is a technique to utilizing the inserted sorter to sort FOUPs and a majority of wafers inside the AMHS.

queen_honey_blossom answered 1 year ago

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