A new process has been developed for applying photoresist to
125-mm silicon wafers used in manufacturing integrated circuits.
Ten wafers were tested, and the following photoresist thickness
measurements (in angstroms x1000) were observed:
13.3987, 13.3957, 13.3902, 13.4015, 13.4001, 13.3918, 13.3965,
13.3925, 13.3946, and 13.4002.
(a) Test the hypothesis that mean thickness is 13.4 x 1000Å. Use =
0.05 and assume a two sided
alternative.
(b) Find a 99% two-sided confidence interval on mean photoresist
thickness. Assume that thickness
is normally...