If the "lift-off" process is used for the metal electrode patterning, choose a photoresist and photomask...

If the "lift-off" process is used for the metal electrode patterning, choose a photoresist

and photomask polarity from the list below. Justify your choice. (4 points)

Photoresist inventory: (1) Shipley 1827, (2) SU-8 2005, (3) Futurrex NR9-8000, (4) Dry film PR

Photomask polarity: (1) Clear field (Bright field), (2) Dark field

Expert Solution

i) photo resist is a photosensitive material being used in industries related to micro electronics. The photo resist are absorbed on the surface of the substrate. The photo resist polarity preferred here would be dry film PR due to to their application in micro electro mechanical system also known as MEMS. It was designed around 30years ago and would be the best photo resist if the lift off process is being used for the electrode plattering. Adhesion is not an issue for dry film and here adhesive property would work as photo resists sticks on the substrate surface using their adhesive property.

ii) The photomasks are chrome coated and lithographic glass templates. These are designed to optically transfer patterns. So photomask polarity used here should be dark field as the electron plattering would be opaque in nature so we need a clear background and it is being obtained by the dark field photomask. The procedure of using of photomask is that it should be used by the opposite nature of background pattern required by us.

Ally Wells answered 8 months ago

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