Question

In: Mechanical Engineering

Metallurgy question:What is the most important properties of these materials ( Lead, tin, Silicon, Arsenic)?

Metallurgy question:What is the most important properties of these materials ( Lead, tin, Silicon, Arsenic)?

Solutions

Expert Solution

Lead :

  • Soft
  • Highly malleable
  • Ductile
  • Poor conductor of electricity
  • Corrosion resistant
  • Low tensile strength of 12-17 MPa
  • High density of 11.3 g/cm3

Tin :

  • Corrosion resistant
  • Soft
  • Pilable
  • Non toxic
  • Ductile
  • Malleable
  • Low melting point
  • It used as oxidation-resistant in coating material

Silicon :

  • Second most abundant electro positive element
  • Very brittle
  • Non-metallic chemical element in carbon family
  • Hard
  • Dark grey solid with metallic lustre
  • Inactive at low temperatures
  • 3 stable isotopes of silicon are : Silicon-28, Silicon-29 and Silicon-30

Arsenic :

  • Brittle
  • Well known poison
  • It under goes sublimation. That is when heated it changes to vapor from solid state.
  • Difficult to convert to water soluble and volatile products.
  • Low thermal and electrical conductivity
  • When heated in air it forms arsenic oxide by combining with oxygen
  • It rarely occurs as a pure element

I just made the answer brief and clear. if you need more data please feel free to comment. I will reply ASAP.

**********************************************************************************************************************************************

If you find my answer useful please give me a thumbsup. It will be very helpful for beginners like me


Related Solutions

Failure times of silicon wafer microchips. Researchers at National Semiconductor experimented with tin-lead solder bumps used...
Failure times of silicon wafer microchips. Researchers at National Semiconductor experimented with tin-lead solder bumps used to manufacture silicon wafer integrated circuit chips. The failure times of the microchips (in hours) were determined at different solder temperatures (degrees Centigrade). The data for one experiment are saved in WAFER file. The researchers want to predict failure time (y) based on solder temperature (x). a. Construct a scatterplot for the data. What type of relationship, linear or curvilinear, appears to exist between...
52. Solder is a mixture of tin and lead. The melting point of tin is 232...
52. Solder is a mixture of tin and lead. The melting point of tin is 232 ◦C and that of lead is 327 ◦C. The melting point for solder (depending on the mixing fractions) generally lies in the range 180 ◦C to 200 ◦C. Why is the melting point of the mixture lower than that of either ingredient?
What process is similar to powdered metallurgy in ceramic materials?
What process is similar to powdered metallurgy in ceramic materials?
Does the force of compaction in powder metallurgy affect final part properties? How?
Does the force of compaction in powder metallurgy affect final part properties? How?  
One integrated circuit design calls for the diffusion of arsenic into silicon wafers; the background concentration...
One integrated circuit design calls for the diffusion of arsenic into silicon wafers; the background concentration of As in Si is 2.5 × 1020 atoms/m3. The predeposition heat treatment is to be conducted at 1000°C for 45 minutes, with a constant surface concentration of 8 × 1026 As atoms/m3. At a drive-in temperature of 1100°C, determine the diffusion time required for a junction depth of 1.2 μm. For this system, values of Qd and D0 are 4.10 eV and 2.29...
Electronic density of states (DOS) is an important physical quantity that dictates materials’ electronic properties.
  Electronic density of states (DOS) is an important physical quantity that dictates materials’ electronic properties. (a) Please also provide arguments and descriptions about how the dimensionality of a system can affect its DOS. (b) Please give two examples of nanostructure or nano‐device that exhibit electronic quantum phenomena, describe their physical property and potential application in detail.
Tin (Sn) metal is a superconductor with a transition temperature of 3.7 K. Its properties are...
Tin (Sn) metal is a superconductor with a transition temperature of 3.7 K. Its properties are well described by the BCS theory. a. What is the zero temperature energy gap (in eV, not J) of Sn? b. The energy gap is the minimum energy required to break apart the Cooper pairs in a superconductor. If the breaking is done by photons what is the longest wavelength photons that can break the pairs? What is the frequency of those photons? 1...
A) What are the difference in properties between the silicon substrate and the oxide layer? B)...
A) What are the difference in properties between the silicon substrate and the oxide layer? B) Design a process that produces the oxide layer on a silicon wafer. C) Design a process that forms the oxide layer only in certain desired areas.
1. When considering an investment in “distressed properties” what are the two most important areas of...
1. When considering an investment in “distressed properties” what are the two most important areas of research that should be undertaken? Please respond in at least 4 – 5 sentences. 2. What types of fees and conditions are prohibited under RESPA? Please respond in at least 3 – 4 sentences.
1(a). Based on the solubility properties of the tin(IV) halides, how do they differ from the...
1(a). Based on the solubility properties of the tin(IV) halides, how do they differ from the more commonly encountered metal halides of metals such as sodium or magnesium? 1(b). What is an "adduct"? Identify an example from the chemistry of SnCl4, and one from the chemistry of boron. 1(c). What structures would be predicted for SnCl2, SnCl4, and Cl4Sn(PPh3) using VSEPR theory. (Assume SnCl2 is monomeric).
ADVERTISEMENT
ADVERTISEMENT
ADVERTISEMENT