Question

Failure times of silicon wafer microchips. Researchers at National Semiconductor experimented with tin-lead solder bumps used to manufacture silicon wafer integrated circuit chips. The failure times of the microchips (in hours) were determined at different solder temperatures (degrees Centigrade). The data for one experiment are saved in WAFER file. The researchers want to predict failure time (y) based on solder temperature (x). a. Construct a scatterplot for the data. What type of relationship, linear or curvilinear, appears to exist between failure time and solder temperature? b. Fit the model, ? = ?0 + ?1? + ?2?2 + ?, to the data. Give the least squares prediction equation. c. Conduct a test to determine if there is upward curvature in the relationship between failure time and solder temperature. (Use α = .05) Please use R studio software to get data. TEMP FAILTIME 165 200 162 200 164 1200 158 500 158 600 159 750 156 1200 157 1500 152 500 147 500 149 1100 149 1150 142 3500 142 3600 143 3650 133 4200 132 4800 132 5000 134 5200 134 5400 125 8300 123 9700

Answer 1

Solution: