Questions
Q1. Explain how industrial Ethernet can be incorporated in DCS systems. Q2. Explain in detail the...

Q1. Explain how industrial Ethernet can be incorporated in DCS systems.

Q2. Explain in detail the self-diagnosis concepts of a DCS system.

In: Electrical Engineering

A designer must anticipate and understand the manufacturing processes that will be used to fabricate the...

A designer must anticipate and understand the manufacturing processes that will be used to fabricate the created components. Describe differences in the model for a part designed for polyethylene (plastic) injection molding versus one for machined aluminum. Can you anticipate unique model requirements for a part created using hand lay-up resin-transfer molded composite (a process similar to that used for fiberglass)?

In: Electrical Engineering

How would you explain the view of a control chart and what is the basic procedure...

How would you explain the view of a control chart and what is the basic procedure for creating it?

In: Electrical Engineering

purpose of a signalling system

purpose of a signalling system

In: Electrical Engineering

Voltage Scaling on Oscilloscope Time scaling Picture is required here from oscilloscope Triggering Function Picture is...

Voltage Scaling on Oscilloscope

Time scaling

Picture is required here from oscilloscope

Triggering Function

Picture is required here from oscilloscope

Cursor function

Picture is required here from oscilloscope

In: Electrical Engineering

Time Scaling on Oscilloscope and function generator to triangular wave

Time Scaling on Oscilloscope

and function generator to triangular wave

In: Electrical Engineering

Explain with suitable diagram how n-type semiconductor can be obtained from intrinsic silicon

Explain with suitable diagram how n-type semiconductor can be obtained from intrinsic silicon

In: Electrical Engineering

Discuss the advantages and disadvantages of IC assembly-based wirebond interconnections versus flip chip interconnections.

Discuss the advantages and disadvantages of IC assembly-based wirebond interconnections versus flip chip interconnections.

In: Electrical Engineering

Define/explain intrinsic semiconductor. What are its characteristics

Define/explain intrinsic semiconductor. What are its characteristics

In: Electrical Engineering

The inner and outer diameter of a single core cable are 3 cm and 8.5 cm...

The inner and outer diameter of a single core cable are 3 cm and 8.5 cm The insulated with two materials having relative permittivity of 5 and 3.5 respectively with corresponding maximum electric stresses of 35 kV/cm and 25 kV/cm. Draw the configuration and calculate:
a) the radial thickness of each insulating layer.
b) the safe working voltage of the cable.
c) draw the voltage and electric stress as a function of radial distance from center to metal sheath.

In: Electrical Engineering

arduino firmware coding for bidirectional closed loop buck boost converter pwm signal

arduino firmware coding for bidirectional closed loop buck boost converter pwm signal

In: Electrical Engineering

Describe the information/data exchanges for Fieldbus Systems on device and control level as well as examples of network/communication protocols used.

Describe the information/data exchanges for Fieldbus Systems on device and control level as well as examples of network/communication protocols used.

In: Electrical Engineering

Describe the main approaches that was followed in designing the SCADA software system and the new approach for current systems

Describe the main approaches that was followed in designing the SCADA software system and the new approach for current systems

In: Electrical Engineering

Plot the radiation pattern of loop antenna with the circumference approximately equals to ?, operating at...

Plot the radiation pattern of loop antenna with the circumference approximately equals to ?, operating at 1 GHz frequency.

In: Electrical Engineering

Question: How to delay this code from 1 second delay to 0.5 second delay? org 0000h;...

Question: How to delay this code from 1 second delay to 0.5 second delay?

org 0000h;

ljmp main;

org 0050h;

main:

     mov dptr,#SMG_DUAN ;

    mov r0,#00h;

    mov r1,#0ah;

lin1:mov a,r0;

    movc a,@a+dptr; get first indexed data in rom to accumolator a

    mov p1,a; move data in a to port 1

    lcall delay; subroutine call for the delay

    inc r0; increase r0 by one to get to the next index

    djnz r1,lin1; repeat the above instructions till we get all the data

    sjmp main;

delay:

mov r3,#0fh; move 0fh to regester 3

lin2: mov r4,#0ffh; mov 0ff to reginster 4

lin3: mov r5,#0ffh; move 0ff to register 5

djnz r5,$; decrease r5 till it equal to 0

djnz r4,lin3; decrease r4 till it equal to 0

djnz r3,lin2; decrease r3 till it equal to 0

ret

org 0200h

SMG_DUAN: ; rom memeory

   db 0c0h,0f9h,0a4h,0b0h,99h,92H,82h,0f8h;

   db 80h,90h,88h,7ch,39h,5eh,79h,71h;

   end

In: Electrical Engineering