In: Electrical Engineering
2, Die deprocessing.
a) Name TWO materials that typically made up the passivation layers.
b) Reactive Ion Etching (RIE) is a type of dry etching which is of plasma-based. With an aid of diagram, explain the mechanism of RIE.
c) Wet etching and dry etching are the most common die deprocessing techniques. Give TWO advantages and disadvantages of wet etching in form of tables.