Question

If we want to pattern thick film (i.e. metal Ni, 3 micrometer) on a 4 inch Si wafer by electrochemical deposition, please give a possible sketch for the deposition, and comment deposition parameters for the process.

Answer 1

Electrochemical deposition – Electrochemical deposition of Ni (3 micron meter) wafer is a equivalent process as of electroplating metals or materials . The method firstly needs that the metal source should be connected to a +tively charged electrode, in thje mean time the substrate is to be connected to the negatively charged electrode. After this both of the terminal materials and substrate have to be connected to electrodes, and are kept in the electrolytic solution for deposition of nickel film. Now if both parts are fully submerged, a DC charge flow to the anode +tively charged electrode, that will oxidizes the metal and it is dissolves in solution. Negatively charged substrate attracts positive charged ions at  the nickel (Ni) film creating a uniform film. Ensuring cleanliness, this completely process will take place inside neat and clean room, and this plating solution will be continuously filtered so that preventing unwanted particles to damage the wafer.