In: Electrical Engineering
1. Explain the primary difficulty with evaporation — the reason that it is not suitable for use in modern CMOS process, which have very small features with etched patterns that have a high aspect ratios.?
2. Regarding the previous question — how does sputtering solve the problem that evaporation suffers from??
3. Explain the purpose of standard clean that we used when processing the wafers in the lab. (You need an answer that is more detailed than “It cleaned the wafers.”)?