1. Of the physical changes listed below, which one absorbs
energy?
sublimation
condensing
freezing
deposition
2. As a solid melts to form a liquid, its temperature
increases.
True
False
3. Which term below best describes the element americium,
Am?
nonmetal
transition metal
inner transition metal
halogen
4. Consider the Lewis symbol for nitrogen. How many single (i.e.
unpaired) electrons are on this atom?
2
4
1
3
For each phase change, determine the sign of \({\Delta H}\) and \(\Delta S\) Sublimation, Freezing,Condensation, Deposition, Boiling, Melting
a) \(+\Delta \mathrm{H},+\Delta \mathrm{S}\)
b) \(-\Delta \mathrm{H},-\Delta \mathrm{S}\)
c) \(+\Delta H,-\Delta S\)
d) \(-\Delta H,+\Delta S\)
Put the phase change to the correctsign of \(\Delta \mathrm{H}\) and \(\Delta \mathrm{S}\)
in
your own words :
1) define the matching principle as you understand it
2) discuss the importance and implication of the matching
principle with regards to the financial information and the
reporting process
(a) The sublimation energy of bulk gold is 334 Kjmol-1 and the
surface energy is 1.5 Jm2. What percentage of
the bulk bonding energy is lost by atoms at the (111) surface of
gold.? The unit cell length of gold is 4.08 Ao
b) Further (to a) calculate the melting temperature for a 4 nm
gold particle given a bulk melting temperature
of 1273 K and a density of 19500 kgm-3 and a latent heat of fusion
of 12.2 Kjmol-1
The entropy of sublimation of a certain compound is 20.7 J K–1
mol–1 at its normal sublimation point of 101 °C. Calculate the
vapour pressure (in torr) of the compound at 9 °C. Assume that the
enthalpy of sublimation is constant.
OBJECTIVES:
1. Define abusive conduct in the workplace.
2. Understand the concept of fraud
deterrence.
3. Define and understand the various applications of
forensic accounting.
UNIT EIGHT
Coating and Deposition
Processes
Explain the difference between coating and cladding
Describe the two main methods of painting: dipping and spraying
(manual, automatic or electrostatic).
State the characteristic of each method.
Identify materials suitable for each method.
Describe the electroplating process.
List typical plating materials and give reasons for their
use.
Explain the process of anodizing and state typical
applications.
Classify vapour deposition processes into physical vapour
deposition (PVD) and chemical vapour deposition (CVD).
Describe the principle...
1. What are the Limits of the material being
processed in the Fused Deposition Modeling (FDM), apart from using
Thermoplastic only?
2. What are the Limits of the equipment being
used in the Fused Deposition Modeling (FDM), apart from producing
small parts only?